Microelectronics Packaging Handbook Semiconductor Packaging
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Microelectronics Packaging Handbook Semiconductor Packaging

Microelectronics Packaging Handbook Semiconductor Packaging Part II 2nd Edition | PDF Free Download.

Microelectronics Packaging Contents

  • Chapter 7. Microelectronics Packaging-An Overview
  • Chapter 8. Chip-To-Package Interconnections
  • Chapter 9. Ceramic Packaging 
  • Chapter 10. Plastic Packaging 
  • Chapter 11. Polymers In Packaging 
  • Chapter 12. Thin-Film Packaging 
  • Chapter 13. Package Electrical Testing
  • Chapter 14. Package Sealing And Encapsulation

Preface to Microelectronics Packaging Handbook Semiconductor Packaging

"This book reflects a need based on an ever-increasing realization by the microelectronics community that while the semiconductors continue to be improved upon relentlessly for performance, cost, and reliability, it is the packaging of these microelectronic devices that may limit the performance of the system.

In response to this need, the academic community began to ask its industrial counterparts what packaging is all about, and what scientific and technological areas should be pursued in collaboration with industry.

As a result of these discussions, a number of universities in the United States and throughout the world already have research and! or teaching programs in various aspects of packaging, ranging from materials, assembly, electrical, and thermal modeling, thin films, and many others.

The multidisciplinary nature of packaging technology clearly poses challenges not only to this community but also to industrial colleagues who will have to use scientific fundamentals from a cross-section of disciplines to bring about advanced products."

That's the way we began the preface of the 1st edition of the Microelectronics Packaging Handbook in 1989. The first sentence is true today; however, two additional factors have become more important: cost and size.

This is readily apparent when one considers consumer electronics. The use of packaged microelectronics has increased tremendously in a great variety of applications-television, including computers, communications, navigation, automotive, avionics, medical, and so forth.

Perhaps the biggest change is the degree to which universities have embraced the field of microelectronics and established major research and teaching programs.

Also, the growth in coverage of microelectronics packaging by technical societies-both in technical symposia and in tutorial sessions-has been dramatic.

While the book is not intended to be a classic textbook for any course in packaging, it does attempt to define what microelectronics packaging is all about, including the current state of the technology across all engineering and scientific disciplines, and the fundamental areas that could impact the industrial needs.

It also provides a comprehensive source of information on all aspects of microelectronics packaging.

Packaging of electronic circuits is the science and art of establishing interconnections and a suitable operating environment for primarily electronic circuits to process and store information.

Accordingly, microelectronics packaging in this book is assumed to mean those designs and interconnection technologies necessary to support electrically, optically, thermally, mechanically, and chemically those semiconductor devices with micron and submicron dimensions that are often referred to as integrated circuits.

Electronic components and their packaging are the building blocks for a vast variety of equipment.

Customer demand and competition among equipment suppliers result in continuing enhancements and evolution of these building blocks, particularly in terms of cost, performance, quality, and reliability.

Since publishing the first edition of this book, a number of paradigm shifts have taken place in the electronics industry.

For one, the emphasis on systems has changed from mainframe computers to personal computers and portable, wireless systems requiring ultra-low-cost, thin, light, and portable packages.

Second, semiconductor technologies have shifted emphasis from bipolar to CMOS. A number of paradigm shifts have taken place in packaging as well. Direct chip attach was possible in 1989 only to such inorganic substrates as alumina and silicon.

Today, chips can be bonded and used directly on printed wiring boards. The board itself is undergoing major change, allowing very high-density wiring by photolithographic processes in contrast to mechanical drilling, which became expensive and obsolete.

The very high reliability that was achieved previously only with ceramic packages is now beginning to be achieved with organic packages and boards without hermeticity.

This book is written with these changes in mind and consistent with the needs of the industry. This collection of books is organized into three parts.

Part 1 includes chapters 1 through 6 and covers the driving forces of microelectronics packaging-electrical, thermal, and reliability.

In addition, Part 1 introduces the technology developer to aspects of manufacturing that must be considered during product development.

Part 2, chapters 7 through 14, covers the interconnection of the IC chip to the first level of packaging and all first level packages.

Part 2 also includes an electrical test as well as sealing and encapsulation technologies.

Part 3, chapters 15 through 20, covers board level packaging as well as connectors, cables, and optical packaging.

The general overview of packaging is repeated in each part as chapters 1, 7, and 15. The main problem of creating a handbook in any field is obvious: by the time the book is completed, much of the information in it may require updating.

This is particularly true with microelectronics packaging, which is one of the fastest, if not the fastest, growing of all technologies.

The first edition was a beginning and this 2nd edition is long overdue. Further development and refinement, based on the comments and suggestions of the users, can appear in future editions. The book in its present state reflects what we believe the community wants currently.

We are exploring new ways of providing the information on a more current basis including electronic publishing and interchange.

The first edition was written entirely by IBMers. We tried to include as many non-IBM technologists as possible and to minimize the use of IBM jargon.

This 2nd edition includes 74 authors, each an expert in his or her own field, from many companies, universities, and countries. We believe that this second edition provides a very representative and comprehensive look at the field of microelectronics packaging.

Any handbook requires the dedication of a number of individuals involved in writing, typing, graphics preparation, manuscript reviewing, copyediting, and publishing, and managing all these operations in such a way that the final book is available in a timely manner.

Above all, a free and stimulating attitude on the part of all the participants is necessary. In addition to the chapter authors, we would like to acknowledge the work of Debra Kelley in helping to keep us on track and for her efforts in preparing some of the manuscripts.

It should be pointed out that the extensive use of the Internet permitted us to work together more easily and cost-effectively.

Our thanks to Jim Geronimo and Barbara Tompkins for the preparation of numerous drafts, extensive copyediting, and their willingness to be sure that all appropriate authors had timely copies to review.

Also to Kristi Bockting and the staff at W WorldCom for the monumental job of incorporating all author comments into the final "camera-ready" manuscript.

Our greatest thanks go to our wives, Anne Tummala and Jean Rymaszewski, and Mary Ann Klopfenstein for their patience and full support. We thank Bertrand Cambou, Motorola Senior VicePresident for the insightful Foreword.

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